Xiaomi Partners with TSMC to Produce New Xring O3 Chip

Xiaomi has unveiled its new in-house Xring O3 smartphone processor, which will be manufactured by TSMC using advanced 3-nanometre production technology.

The new chip is expected to power Xiaomi's upcoming flagship folding phone, with the company setting a production shipment target of 200,000 to 300,000 units.

This move follows the launch of the Xring O1 in May 2025, which has powered over 1 million devices, including smartphones, tablets, and watches, to date.