Samsung To Use TSMC Process For Nvidia Custom Memory Chips

Samsung Electronics will use TSMC's 3-nanometre manufacturing process to produce base dies for Nvidia's next-generation custom high-bandwidth memory chips.

The agreement marks the first time Samsung has partnered with the Taiwanese foundry giant at the HBM manufacturing stage.

Samsung accepted the requirement after an internal review but plans to maintain in-house production for standard HBM and other customer products.